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X光线阵传感器芯片-BGXP09S
BGXP09S is a high-performance CMOS image sensor chip featuring high integration, high speed, high precision, high reliability, and low-dose operation. With a pixel size of 200 µm, it supports four-line TDI operation.
特点:
Pixel size of 200 µm
Compatible with linear mode and HDR mode
Maximum line rate of 60 kHz
Maximum ADC resolution of 14 bit
Radiation-hardened design
Flexible combination to achieve the required target size based on demand
应用:
Industrial inspection
PCB inspection
Food inspection
详细参数
ParameterValueUnit
Active Pixel Array Area51.2 × 0.8mm
Active Pixel Array256(H) × 4(V)
Pixel Size200 × 200µm
Line Rate60 kHz/Lines
ShutterRolling/Global shutter
Read Noise300e-
Dynamic Range85dB
FWC5.5Me-
TID Resistance50kGy
Output InterfaceLVDS/IIC
Data Format14 bit RAW
Power Supply - VDDIO1.8-3.0V
Power Supply - VH4.0V
Power Supply - VDDD2.5-3.0V
Power Supply - VDDA_LDO3.3V
Power Consumption2.5W
Size (L×W×H)52 × 20 × 6mm
Weight0.1kg
Junction Temperature Range0-65°C
PackageCOB

Note: The specified temperature is the junction temperature range, not the ambient temperature.

量子效率曲线
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