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X光线阵传感器芯片-BGXP10S
BGXP10S is a high-performance CMOS image sensor chip featuring high integration, high speed, high precision, high reliability, and low-dose operation. With a pixel size of 100 µm, it supports 64-stage TDI operation.
特点:
Pixel size of 100 µm
Compatible with linear mode and HDR mode
Maximum line rate of 6.25 kHz with 64-stage TDI
Maximum ADC resolution of 14 bit
Radiation-hardened design
Flexible combination to achieve the required target size based on demand
应用:
Industrial inspection
PCB inspection
Food inspection
详细参数
ParameterValueUnit
Active Pixel Array Area51.2 × 6.4mm
Active Pixel Array512(H) × 64(V)
Pixel Size100 × 100µm
Line Rate6.25K LPS (@64 stage)
ShutterRolling/Global shutter
Read NoiseSLFW: 0.2 / LFW: 0.3 / HFW: 0.6 / SHFW: 1.2ke-
Dynamic Range69dB
FWCSLFW: 400 ke- / LFW: 700 ke- / HFW: 1.5 Me- / SHFW: 3.7 Me-
TID Resistance50kGy
Output InterfaceLVDS/IIC
Data Format12 bit/14 bit RAW
Power Supply - VDDIO1.8-3.0V
Power Supply - VH4.0V
Power Supply - VDDD_DIG2.5-3.0V
Power Supply - VDDA_LDO3.3V
Power Consumption2.5W
Size (L×W×H)52 × 42 × 6mm
Weight0.1kg
Junction Temperature Range0-65°C
PackageCOB

Note: The specified temperature is the junction temperature range, not the ambient temperature.

量子效率曲线
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